Light-emitting diode (led) package with reflective coating and method of manufacture

A method of manufacturing an LED package, the method comprising:

• providing a plurality of LED die assemblies, each of the plurality of LED die assemblies comprising an LED die, a wavelength converting element having a bottom surface adjacent a top surface of the LED die, and a sacrificial layer having a bottom surface adjacent a top surface of the wavelength converting element;
• spacing the plurality of LED die assemblies apart;
• molding a light reflecting material around, between and over the plurality of LED die assemblies;
• and
• removing at least a portion of the light reflecting material over a top surface of the sacrificial layer to form a wafer, such that at least a portion of the light reflecting material remains after the removing and extends above a top surface of the wavelength converting element.