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US 2023/0155053 A1Published application
System and methods for managing heat in a photonic integrated circuit
AssigneeAcacia Communications, Inc.
InventorJohn Heanue
Life of this patent
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Abstract
In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.
Claims17
-13. (canceled)
An optical transceiver comprising:
- a housing comprising an interior surface and exterior surface;
- a plurality of pins extending outward from the exterior surface of the housing;
- an interior volume at least partially enclosed within and defined by the housing;
- a plurality of connectors disposed along the interior surface of the housing, the plurality of connectors electrically connected to the plurality of pins;
- and
- a PIC assembly comprising a plurality of bond pads, the PIC assembly disposed in the interior volume,
- wherein each of the bond pads is uniquely electrically connected to an associated connector of the plurality of connectors along the interior surface of the housing with a bonding wire at least partially rounded across a distance between each of the bond pads and each associated connector, wherein a length of the bond wire is greater than a distance between each of the bond pads and the associated connector.
4 more elements
A method of manufacturing an optical transceiver, the method comprising:
- providing a housing comprising
- an interior surface and exterior surface,
- a plurality of pins extending outward from the exterior surface of the housing,
- an interior volume at least partially enclosed within the housing, and
- a plurality of connectors along the interior surface of the housing electrically connected to the plurality of pins;
- and
- coupling a PIC assembly to a packaging or the housing, wherein the PIC assembly includes a plurality of bond pads.
4 more elements
Dependencies are inferred from the claim text.