Structure and formation method of semiconductor device with epitaxial structures
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorKa-Hing FUNG
Life of this patent
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Abstract
A semiconductor device structure and a method for forming a semiconductor device structure are provided. The semiconductor device structure includes a stack of channel structures over a semiconductor substrate and a gate stack wrapped around the channel structures. The semiconductor device structure also includes a source/drain epitaxial structure adjacent to the channel structures and multiple inner spacers. Each of the inner spacers is between the gate stack and the source/drain epitaxial structure. The semiconductor device structure further includes multiple epitaxial structures separating the inner spacers from the source/drain epitaxial structure.
Claims20
A semiconductor device structure, comprising:
- a stack of channel structures over a semiconductor substrate;
- a gate stack wrapped around the channel structures;
- a source/drain epitaxial structure adjacent to the channel structures;
- a plurality of inner spacers, wherein each of the inner spacers is between the gate stack and the source/drain epitaxial structure;
- and
- a plurality of epitaxial structures separating the inner spacers from the source/drain epitaxial structure.
A semiconductor device structure, comprising:
- a channel structure over a semiconductor substrate;
- a gate stack wrapped around the channel structure;
- a source/drain epitaxial structure connecting the channel structures;
- an inner spacer between the gate stack and the source/drain epitaxial structure;
- and
- an epitaxial structure between the inner spacer and the source/drain epitaxial structure.
A method for forming a semiconductor device structure, comprising:
- forming a fin structure over a semiconductor substrate, wherein the fin structure has a plurality of sacrificial layers and a plurality of semiconductor layers, and the sacrificial layers and the semiconductor layers are laid out alternately;
- forming a dummy gate stack to cover a portion of the fin structure;
- partially removing the fin structure to form a first recess;
- partially removing the sacrificial layers exposed by the first recess to form a plurality of second recesses partially exposing the semiconductor layers;
- forming a plurality of inner spacers in the second recesses to cover edges of the sacrificial layers;
- forming epitaxial structures in the second recesses to cover the inner spacers;
- forming a source/drain epitaxial structure in the first recess;
- removing the dummy gate stack and the sacrificial layers to form a plurality of semiconductor nanostructures made of remaining portions of the semiconductor layers;
- and
- forming a metal gate stack to wrap around the semiconductor nanostructures.
Dependencies are inferred from the claim text.