Semiconductor substrate and electrical inspection method

A semiconductor substrate electrically connected to an external substrate, the semiconductor substrate comprising:

• an internal circuit that is a circuit to which a signal is input from the external substrate or a circuit that outputs a signal to the external substrate;
• a plurality of first pads electrically connecting the internal circuit to the external substrate;
• and
• one or a plurality of second pads that have a surface hardness lower than that of the plurality of first pads and do not electrically connect the internal circuit to the external substrate.

An electrical inspection method comprising:

• preparing a semiconductor substrate including an internal circuit, a plurality of first pads electrically connected to the internal circuit, and one or a plurality of second pads not electrically connected to the internal circuit;
• preparing an inspection substrate to which a plurality of inspection needles are connected;
• and
• contacting the plurality of inspection needles with the plurality of first pads and the one or plurality of second pads, wherein
• the plurality of first pads have a surface hardness higher than a hardness of a plurality of first inspection needles that are some of the plurality of inspection needles and come into contact with the plurality of first pads in the contacting, and
• the one or plurality of second pads have a surface hardness lower than a hardness of one or plurality of second inspection needles that are some of the plurality of inspection needles and come into contact with the one or plurality of second pads in the contacting.