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US 2023/0154989 A1Published application
Methods of Forming Conductive Pipes Between Neighboring Features, and Integrated Assemblies Having Conductive Pipes Between Neighboring Features
AssigneeMicron Technology, Inc.
InventorsAhmed Nayaz Noemaun, Stephen W. Russell, Tao D. Nguyen, Santanu Sarkar
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Abstract
Some embodiments include an integrated assembly having a pair of substantially parallel features spaced from one another by an intervening space. A conductive pipe is between the features and substantially parallel to the features. The conductive pipe may be formed within a tube. The tube may be generated by depositing insulative material between the features in a manner which pinches off a top region of the insulative material to leave the tube as a void region under the pinched-off top region.
Claims22
1-31 (canceled)
A method of forming an integrated assembly, comprising:
- forming first and second features spaced from one another by an intervening space;
- the first and second features being substantially parallel to one another;
- forming a dielectric material within the intervening space, the dielectric material pinching off at a top of the intervening space to form a tube which extends substantially parallel to the first and second features;
- and
- forming conductive material within the tube to thereby pattern a conductive pipe within the tube;
- the conductive pipe being substantially parallel to the first and second features.
3 more elements
Dependencies are inferred from the claim text.