Imaging element
AssigneeSony Semiconductor Solutions Corporation
InventorsKeiichi NAKAZAWA, Yoshiaki KITANO, Hirofumi YAMASHITA, Minoru ISHIDA
Life of this patent
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Abstract
An imaging element according to an embodiment of the present disclosure includes: a first substrate, a second substrate, and a third substrate that are stacked in this order. The first substrate including a sensor pixel that performs photoelectric conversion and the second substrate including a readout circuit are electrically coupled to each other by a first through wiring line provided in an interlayer insulating film. The second substrate and the third substrate including a logic circuit are electrically coupled to each other by a junction between pad electrodes or a second through wiring line penetrating through a semiconductor substrate.
Claims20
A light detecting device, comprising:
- a first substrate including a sensor pixel in a first semiconductor substrate;
- a second substrate including a readout circuit in a second semiconductor substrate outputting a pixel signal;
- a third substrate including a logic circuit in a third semiconductor substrate processing the pixel signal;
- and
- an interlayer insulating film disposed between the first semiconductor substrate and the second semiconductor substrate,
- wherein a first through wiring line electrically coupling the first substrate of the first semiconductor substrate and the second substrate of the second semiconductor substrate provided in the interlayer insulating film,
- wherein the second substrate and the third substrate each includes a least one set of corresponding electrode pads for electrically coupling and bonding the second substrate and the third substrate, and
- wherein a cross-sectional area throughout the first through wiring line is narrower than a cross-sectional area throughout the at least one set of corresponding electrode pads.
A light detecting device, comprising:
- a first substrate including at least one sensor pixel in a first semiconductor substrate;
- a second substrate including a readout circuit in a second semiconductor substrate outputting a pixel signal for the at least one sensor pixel;
- a third substrate including a logic circuit in a third semiconductor substrate processing the pixel signal for the at least one sensor pixel;
- and
- an interlayer insulating film disposed between the first semiconductor substrate and the second semiconductor substrate,
- wherein a first through wiring line electrically coupling the first substrate of the first semiconductor substrate and the second substrate of the second semiconductor substrate provided in the interlayer insulating film,
- wherein the second substrate and the third substrate each includes a least one set of corresponding electrode pads for electrically coupling and bonding the second substrate and the third substrate,
- wherein a cross-sectional area throughout the at least one through wiring line is narrower than a cross-sectional area throughout the at least one set of corresponding electrode pads, and
- wherein a number of the at least one through wiring line is greater than a number of the at least one sensor pixel included in the first substrate.
A light detecting device, comprising:
- a first substrate including at least one sensor pixel in a first semiconductor substrate;
- a second substrate including a readout circuit in a second semiconductor substrate outputting a pixel signal for the at least one sensor pixel;
- and
- a third substrate including a logic circuit in a third semiconductor substrate processing the pixel signal for the at least one sensor pixel,
- wherein a stacked body of the first substrate and the second substrate includes an interlayer insulating film and at least one through wiring line electrically coupling the first substrate and the second substrate provided in the interlayer insulating film, wherein the second substrate and the third substrate each includes a least one set of corresponding electrode pads for electrically coupling and bonding the second substrate and the third substrate,
- wherein a cross-sectional area throughout the at least one through wiring line is narrower than a cross-sectional area throughout the at least one set of corresponding electrode pads, and
- wherein a number of the at least one set of corresponding electrode pads is smaller than a number of the at least one sensor pixel included in the first substrate.
Dependencies are inferred from the claim text.