Electronic device
AssigneeDenso Corporation
InventorHiroyoshi KUNIEDA
Life of this patent
Estimating the term…
Abstract
An electronic device includes a circuit board, a lower IC package in which a lower IC chip is sealed on a lower package substrate by a lower resin portion being mounted on the substrate via a lower solder connection portion, and an upper IC package in which an upper IC chip is sealed on an upper package substrate by an upper resin portion being mounted on the lower IC package via an upper solder connection portion. The upper IC package is provided with a rigid body having a smaller linear expansion coefficient in a plane direction than that of the upper resin portion. The rigid body is arranged directly above a boundary between the lower IC chip and the lower resin portion.
Claims13
An electronic device, comprising:
- a circuit board;
- a lower IC package in which a lower IC chip is sealed on a lower package substrate by a lower resin portion being mounted on the circuit board via a lower solder connection portion;
- and
- an upper IC package in which an upper IC chip is sealed on an upper package substrate by an upper resin portion being mounted on the circuit board via an upper solder connection portion;
- wherein
- a rigid body having a smaller coefficient of linear expansion in a plane direction than that of the upper resin portion is provided in the upper IC package, and
- the rigid body is arranged directly above a boundary between the lower IC chip and the lower resin portion.
Dependencies are inferred from the claim text.