Light-emitting diode (led) chip assembly and prepraing method thereof, and preparing method of display panel

A light-emitting diode (LED) chip assembly, comprising:

• a patterned substrate defining a plurality of through holes;
• a patterned support layer disposed on a surface of the patterned substrate and attached to the patterned substrate;
• and
• a plurality of LED chips, wherein
• each LED chip at least partially extends into each through hole, the each LED chip is partially embedded in the patterned support layer, and the each LED chip has a face surface away from the patterned support layer;
• the patterned support layer defines a hollow structure which is at a position opposite to a back surface of the each LED chip and is for an operation body to extend into the hollow structure and touch the each LED chip, to apply a pressure to the each LED chip to make the each LED chip fall off the patterned support layer and out of the each through hole;
• and
• the face surface is a surface of the each LED chip facing a drive backplane and the back surface is a surface of the each LED chip away from the drive backplane, when the each LED chip is fixed to the drive backplane.