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US 2023/0154897 A1Published application
High bandwidth die to die interconnect with package area reduction
AssigneeApple Inc.
InventorsChonghua Zhong, Jun Zhai, Kunzhong Hu
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Abstract
Package structure with folded die arrangements and methods of fabrication are described. In an embodiment, a package structure includes a first die and vertical interposer side-by-side. A second die is face down on an electrically connected with the vertical interposer, and a local interposer electrically connects the first die with the vertical interposer.
Claims20
A package on package structure comprising:
- a lower package structure comprising:
- a first die side-by-side with a vertical interposer including a first side and a second side;
- a second die face down on and electrically connected with the second side of the vertical interposer;
- a local interposer underneath and in electrical connection with the first die and the vertical interposer;
- a first plurality of conductive pillars laterally adjacent the first die, the vertical interposer, and the second die;
- and
- a top package structure mounted on the lower package structure and in electrical connection with the first plurality of conductive pillars.
4 more elements
Dependencies are inferred from the claim text.