Semiconductor package including underfill and method of forming the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJinyoung Kim, Jiyeong Kim, Okseon Yoon
Life of this patent
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Abstract
A semiconductor package includes a first semiconductor chip on a lower structure. A first underfill is between the first semiconductor chip and the lower structure. The first underfill includes a first portion adjacent to a center region of the first semiconductor chip, and a second portion adjacent to an edge region of the first semiconductor chip. The second portion has a higher degree of cure than the first portion. A plurality of inner connection terminals is between the first semiconductor chip and the lower structure. The plurality of inner connection terminals extends in the first underfill.
Claims20
A semiconductor package comprising:
- a lower structure;
- a first semiconductor chip on the lower structure;
- a first underfill between the first semiconductor chip and the lower structure, the first underfill comprising a first portion adjacent to a center region of the first semiconductor chip, and a second portion adjacent to an edge region of the first semiconductor chip, the second portion having a higher degree of cure than the first portion;
- and
- a plurality of inner connection terminals between the first semiconductor chip and the lower structure and extending into the first underfill.
A method for forming a semiconductor package, the semiconductor package comprising:
- a lower structure;
- a first semiconductor chip on the lower structure;
- a first underfill between the first semiconductor chip and the lower structure, the first underfill comprising a first portion adjacent to a center region of the first semiconductor chip, and a second portion adjacent to an edge region of the first semiconductor chip, the second portion having a higher degree of cure than the first portion;
- and a plurality of inner connection terminals between the first semiconductor chip and the lower structure and extending into the first underfill, the method comprising:
- forming, on the first semiconductor chip, the plurality of inner connection terminals and a preliminary underfill covering the plurality of inner connection terminals;
- stacking the first semiconductor chip on the lower structure such that the preliminary underfill is bonded between the first semiconductor chip and the lower structure;
- curing the preliminary underfill using a laser bonding process, thereby forming the first underfill, and reflowing the plurality of inner connection terminals during the formation of the first underfill through the curing of the preliminary underfill.
A semiconductor package comprising:
- a lower structure;
- a plurality of semiconductor chips sequentially stacked on the lower structure;
- a plurality of underfills between the plurality of semiconductor chips and the lower structure, each of the plurality of underfills comprising a first portion adj acent to a center region of a semiconductor chip of the plurality of semiconductor chips, and a second portion adjacent to an edge regionof the semiconductor chip, the second portion having a higher degree of cure than the first portion;
- and
- a plurality of inner connection terminals between the plurality of semiconductor chips and the lower structure and extending into the plurality of underfills.
Dependencies are inferred from the claim text.