Semiconductor package with improved connection of the pins to the bond pads of the semiconductor die
AssigneeNexperia B.V.
InventorsRicardo Yandoc, Adam Brown, Haibo Fan
Life of this patent
Estimating the term…
Abstract
A semiconductor package including a semiconductor die having multiple bond pads is provided. The package further includes an electrically conducting clip including, at a first side thereof, at least one pin for mounting the package to an external board and includes, at a second side opposite to the first side, a connecting portion connecting the clip to at least two bond pads of the multiple bond pads. The connection portion includes at least two elongated connecting strips spaced apart from each other at a distance in such a manner that each strip extends over at least one of the at least two bond pads and is connected thereto.
Claims19
A semiconductor package comprising a semiconductor die having multiple bond pads, the package further comprising an electrically conducting clip, wherein the clip comprises, at a first side thereof, at least one pin for mounting the package to an external board and comprises, at a second side opposite to the first side, a connecting portion connecting the clip to at least two bond pads of the multiple bond pads, the connection portion comprising:
- at least two elongated connecting strips spaced apart from each other at a distance so that each strip extends over at least one of the at least two bond pads and is connected thereto.
Dependencies are inferred from the claim text.