Semiconductor device, a package substrate, and a semiconductor package

A semiconductor package comprising a semiconductor device stacked over a package substrate,

• wherein the semiconductor device comprises:
• a semiconductor substrate;
• input/output (I/O) pads disposed adjacent to one surface of the semiconductor substrate;
• and
• first bump pillars disposed over the I/O pads,
• wherein the first bump pillars are selectively arranged over some of the I/O pads in a first horizontal direction,
• wherein the package substrate comprises:
• a base layer;
• and
• bump lands disposed at an upper portion of the base layer,
• wherein each of the bump lands is vertically aligned with each of the I/O pads.

A semiconductor package comprising a semiconductor device stacked over a package substrate,

• wherein the semiconductor device includes:
• a semiconductor substrate;
• input/output I/O) pads disposed adjacent to one surface of the semiconductor substrate;
• and
• first bump pillars disposed over the input/out pads,
• wherein the first bump pillars are arranged to skip being disposed over every other one of the I/O pads in a first horizontal direction,
• wherein the package substrate includes:
• a base layer;
• bump lands disposed at an upper portion of the base layer;
• and
• first land pillars disposed over the bump lands,
• wherein:
• the first land pillars are arranged to skip disposed over every other one of the bump lands in the first horizontal direction, and
• each of the first bump pillars and each of the first land pillars are exclusively arranged not to be vertically aligned with each other.