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US 2023/0154874 A1Published application
Radio frequency chip package
AssigneeWavepia Co., Ltd.
InventorsSang-Hun LEE, Sang-Yeol LEE, Sang-Soo KIM
Life of this patent
Estimating the term…
Abstract
A radio frequency (RF) chip package includes: an RF die; a first peripheral circuit chip; a second peripheral circuit chip; a substrate having a -shaped step formed on a portion thereof so that the RF die is mounted on top of the step of the substrate and the first peripheral circuit chip and the second peripheral circuit chip are mounted on top of the substrate where no step is formed; a first mutual inductance controller for controlling the dimension of the mutual inductance between the first peripheral circuit chip and the RF die; and a second mutual inductance controller for controlling the dimension of the mutual inductance between the second peripheral circuit chip and the RF die.
Claims24
A radio frequency (RF) chip package comprising:
- an RF die;
- a first peripheral circuit chip electrically connected to pads of the RF die by means of wire bonding, having matching circuits or passive elements, and located on the left side of the RF die;
- a second peripheral circuit chip electrically connected to pads of the RF die by means of wire bonding, having matching circuits or passive elements, and located on the right side of the RF die;
- a substrate for mounting the RF die, the first peripheral circuit chip, and the second peripheral circuit chip thereon and having a -shaped step formed on a portion thereof so that the RF die is mounted on top of the step of the substrate and the first peripheral circuit chip and the second peripheral circuit chip are mounted on top of the substrate where no step is formed;
- a first mutual inductance controller spaced apart from the first peripheral circuit chip and the RF die, respectively, on top of the substrate between the first peripheral circuit chip and the RF die, to thus control the dimension of the mutual inductance between the first peripheral circuit chip and the RF die;
- and
- a second mutual inductance controller spaced apart from the second peripheral circuit chip and the RF die, respectively, on top of the substrate between the second peripheral circuit chip and the RF die, to thus control the dimension of the mutual inductance between the second peripheral circuit chip and the RF die.
4 more elements
A radio frequency (RF) chip package comprising:
- an RF die;
- a first peripheral circuit chip electrically connected to pads of the RF die by means of wire bonding, having matching circuits or passive elements, and located on the left side of the RF die;
- a second peripheral circuit chip electrically connected to pads of the RF die by means of wire bonding, having matching circuits or passive elements, and located on the right side of the RF die;
- a substrate for mounting the RF die, the first peripheral circuit chip, and the second peripheral circuit chip thereon and having a -shaped step formed on a portion thereof so that the RF die is mounted on top of the step of the substrate and the first peripheral circuit chip and the second peripheral circuit chip are mounted on top of the substrate where no step is formed;
- and
- a first mutual inductance controller spaced apart from the first peripheral circuit chip and the RF die, respectively, on top of the substrate between the first peripheral circuit chip and the RF die, to thus control the dimension of the mutual inductance between the first peripheral circuit chip and the RF die.
3 more elements
A radio frequency (RF) chip package comprising:
- an RF die;
- a first peripheral circuit chip electrically connected to pads of the RF die by means of wire bonding, having matching circuits or passive elements, and located on the left side of the RF die;
- a second peripheral circuit chip electrically connected to pads of the RF die by means of wire bonding, having matching circuits or passive elements, and located on the right side of the RF die;
- a substrate for mounting the RF die, the first peripheral circuit chip, and the second peripheral circuit chip thereon and having a -shaped step formed on a portion thereof so that the RF die is mounted on top of the step of the substrate and the first peripheral circuit chip and the second peripheral circuit chip are mounted on top of the substrate where no step is formed;
- and
- a second mutual inductance controller spaced apart from the second peripheral circuit chip and the RF die, respectively, on top of the substrate between the second peripheral circuit chip and the RF die, to thus control the dimension of the mutual inductance between the second peripheral circuit chip and the RF die.
3 more elements
A radio frequency (RF) chip package comprising:
- an RF die;
- a first peripheral circuit chip electrically connected to pads of the RF die by means of wire bonding, having matching circuits or passive elements, and located on the left side of the RF die;
- a second peripheral circuit chip electrically connected to pads of the RF die by means of wire bonding, having matching circuits or passive elements, and located on the right side of the RF die;
- a substrate for mounting the RF die, the first peripheral circuit chip, and the second peripheral circuit chip thereon and having a -shaped cavity formed on a portion thereof so that the RF die is mounted on top of the cavity of the substrate and the first peripheral circuit chip and the second peripheral circuit chip are mounted on top of the substrate where no cavity is formed;
- a first mutual inductance controller spaced apart from the first peripheral circuit chip and the RF die, respectively, on top of the substrate between the first peripheral circuit chip and the RF die, to thus control the dimension of the mutual inductance between the first peripheral circuit chip and the RF die;
- and
- a second mutual inductance controller spaced apart from the second peripheral circuit chip and the RF die, respectively, on top of the substrate between the second peripheral circuit chip and the RF die, to thus control the dimension of the mutual inductance between the second peripheral circuit chip and the RF die.
4 more elements
A radio frequency (RF) chip package comprising:
- an RF die;
- a first peripheral circuit chip electrically connected to pads of the RF die by means of wire bonding, having matching circuits or passive elements, and located on the left side of the RF die;
- a second peripheral circuit chip electrically connected to pads of the RF die by means of wire bonding, having matching circuits or passive elements, and located on the right side of the RF die;
- a substrate for mounting the RF die, the first peripheral circuit chip, and the second peripheral circuit chip thereon and having a -shaped cavity formed on a portion thereof so that the RF die is mounted on top of the cavity of the substrate and the first peripheral circuit chip and the second peripheral circuit chip are mounted on top of the substrate where no cavity is formed;
- and
- a first mutual inductance controller spaced apart from the first peripheral circuit chip and the RF die, respectively, on top of the substrate between the first peripheral circuit chip and the RF die, to thus control the dimension of the mutual inductance between the first peripheral circuit chip and the RF die.
3 more elements
A radio frequency (RF) chip package comprising:
- an RF die;
- a first peripheral circuit chip electrically connected to pads of the RF die by means of wire bonding, having matching circuits or passive elements, and located on the left side of the RF die;
- a second peripheral circuit chip electrically connected to pads of the RF die by means of wire bonding, having matching circuits or passive elements, and located on the right side of the RF die;
- a substrate for mounting the RF die, the first peripheral circuit chip, and the second peripheral circuit chip thereon and having a -shaped cavity formed on a portion thereof so that the RF die is mounted on top of the cavity of the substrate and the first peripheral circuit chip and the second peripheral circuit chip are mounted on top of the substrate where no cavity is formed;
- and
- a second mutual inductance controller spaced apart from the second peripheral circuit chip and the RF die, respectively, on top of the substrate between the second peripheral circuit chip and the RF die, to thus control the dimension of the mutual inductance between the second peripheral circuit chip and the RF die.
3 more elements
Dependencies are inferred from the claim text.