Electronic package and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsChih-Hsien Chiu, Ko-Wei CHANG
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Abstract
An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.
Claims12
An electronic package, comprising:
- a carrier;
- an electronic component disposed on the carrier;
- and
- an inductive structure disposed between the carrier and the electronic component, wherein the inductive structure comprises at least one magnetically permeable member and a conductor structure surrounding the at least one magnetically permeable member.
Dependencies are inferred from the claim text.