Semiconductor device, semiconductor package, and memory system

A semiconductor package comprising:

• a package substrate;
• and
• a first semiconductor device and a second semiconductor device stacked in a first direction, the first direction being perpendicular to an upper surface of the package substrate, wherein
• each of the first semiconductor device and the second semiconductor device includes a semiconductor substrate, a plurality of via structures passing through the semiconductor substrate, a coil pattern surrounding at least one via structure of the plurality of via structures in a second direction, and an input/output (I/O) circuit connected to at least one of the plurality of via structures and the coil pattern, and the second direction is parallel to an upper surface of the semiconductor substrate,
• the at least one via structure provides a first transmission path of a first signal, and
• the coil pattern provides a second transmission path of a second signal, different from the first signal.

A memory system comprising:

• a printed circuit board (PCB);
• a host device on the PCB;
• and
• a memory package on the PCB, the memory package including a plurality of memory devices stacked on each other, and connected to the host device, wherein
• the plurality of memory devices includes a plurality of through-silicon vias (TSVs) and a plurality of coil patterns surrounding at least one of the plurality of TSVs, and
• the plurality of memory devices exchange signals with the host device through the plurality of TSVs and the plurality of coil patterns.