Semiconductor devices with reinforced substrates
AssigneeMicron Technology, Inc.
InventorsKoustav Sinha, Shams U. Arifeen, Christopher Glancey
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Abstract
Semiconductor devices having reinforcement structures configured to mitigate thermomechanical stresses, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor package includes a semiconductor die and a substrate coupled to the semiconductor die. The substrate can include a base structure and a reinforcement structure at least partially within a die shadow region of the substrate. The reinforcement structure can be at least partially surrounded by the base structure. The reinforcement structure has a higher stiffness than the base structure.
Claims20
A method for manufacturing a semiconductor assembly, the method comprising:
- fabricating a substrate by:
- forming a recess in a base structure, and
- positioning a reinforcement structure at least partially in the recess, wherein the reinforcement structure has a higher stiffness than the base structure;
- and
- mounting a semiconductor die onto the substrate such that the semiconductor die is positioned at least partially over the reinforcement structure.
A method of manufacturing a semiconductor assembly comprising:
- forming a recess in a first substrate section;
- positioning a reinforcement structure in the recess;
- forming a package substrate by coupling a second substrate section to the first substrate section such that the reinforcement structure is disposed between the first and second substrate sections;
- and
- mounting a semiconductor die on the package substrate.
A method of manufacturing a semiconductor assembly comprising:
- forming a lower substrate section including a base material;
- forming a middle substrate section including a plurality of reinforcement structures and a portion of the base material adjacent to the plurality of reinforcement structures;
- forming an upper substrate section including the base material;
- assembling a package substrate by coupling the lower substrate section, the middle substrate section, and the upper substrate section;
- and
- mounting a semiconductor die on the package substrate.
Dependencies are inferred from the claim text.