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US 2023/0154867 A1Published application
Chip structure and semiconductor structure
AssigneeChangxin Memory Technologies, Inc.
InventorLING-YI CHUANG
Life of this patent
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Abstract
The present disclosure provides a chip structure and a semiconductor structure. The chip structure includes: a substrate; a functional region located on the substrate; a guard ring structure surrounding the functional region; and an auxiliary bonding region located above the guard ring structure, where there is an overlapping region between a projection of at least part of the auxiliary bonding region on the substrate and a projection of the guard ring structure on the substrate.
Claims17
A chip structure, comprising:
- a substrate;
- a functional region located on the substrate;
- a guard ring structure surrounding the functional region;
- and
- an auxiliary bonding region located above the guard ring structure, wherein there is an overlapping region between a projection of at least part of the auxiliary bonding region on the substrate and a projection of the guard ring structure on the substrate.
2 more elements
Dependencies are inferred from the claim text.