Molded Laser Package with Electromagnetic Interference Shield and Method of Making
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsDeokKyung Yang, HunTeak Lee, HeeSoo Lee, Wanil Lee, SangDuk Lee
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Abstract
A semiconductor device has a substrate comprising a carrier and an interposer disposed on the carrier. An electrical component is disposed over a first surface of the interposer. An interconnect structure is disposed over the first surface of the interposer. An encapsulant is deposited over the electrical component, interconnect structure, and substrate. A trench is formed through the encapsulant and interposer into the carrier. A shielding layer is formed over the encapsulant and into the trench. The carrier is removed after forming the shielding layer.
Claims25
A method of making a semiconductor device, comprising:
- providing a semiconductor die;
- depositing an encapsulant over the semiconductor die;
- forming a trench in the encapsulant around the semiconductor die;
- forming a shielding layer over the encapsulant and into the trench;
- forming an opening in the shielding layer;
- and
- disposing a solder bump in the opening.
A method of making a semiconductor device, comprising:
- providing a semiconductor die;
- depositing an encapsulant over the semiconductor die;
- forming a shielding layer over the encapsulant;
- forming an opening in the shielding layer;
- and
- disposing a solder bump in the opening.
A semiconductor device, comprising:
- a semiconductor die;
- an encapsulant deposited over the semiconductor die;
- a shielding layer formed over and around the encapsulant;
- an opening formed in the shielding layer;
- and
- a solder bump disposed in the opening.
A semiconductor device, comprising:
- providing a semiconductor die;
- depositing an encapsulant over the semiconductor die;
- forming a shielding layer over the encapsulant;
- forming an opening in the shielding layer;
- and
- disposing a solder bump in the opening.
Dependencies are inferred from the claim text.