Layouts for conductive layers in integrated circuits

An integrated circuit, comprising:

• a substrate;
• a circuit formed in, on, or above the substrate;
• a first conductor layer that is one of an orthogonal conductor layer or a non-orthogonal conductor layer disposed above the substrate, the first conductor layer comprising a first conductive interconnect;
• a transition conductor layer disposed above the first conductor layer, the transition conductor layer comprising a conductor that is electrically connected to the first conductive interconnect;
• and
• a second conductor layer that is the other one of the orthogonal conductor layer or the non-orthogonal conductor layer and disposed above the transition conductor layer, the second conductor layer comprising a second conductive interconnect that is electrically connected to the conductor in the transition conductor layer.

A method of providing an integrated circuit, the method comprising:

• forming a first conductor layer comprising a first plurality of conductive interconnects arranged according to one of an orthogonal layout or a non-orthogonal layout;
• forming a transition conductor layer above the first conductor layer, the transition conductor layer comprising a plurality of conductors arranged according to a transition layout;
• and
• forming a second conductor layer above the transition conductor layer, the second conductor layer including a second plurality of conductive interconnects arranged according to the other one of the orthogonal layout or the non-orthogonal layout,
• wherein each conductor of the plurality of conductors in the transition conductor layer is electrically connected to a respective conductive interconnect in the first plurality of conductive interconnects and a respective conductive interconnect in the second plurality of conductive interconnects.