Package structure with through vias
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsLing-Wei LI, Jung-Hua CHANG, Cheng-Lin HUANG
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Abstract
A package structure is provided. The package structure includes a conductive structure having a first portion and a second portion, and the second portion is wider than the first portion. The package structure also includes a semiconductor chip laterally separated from the conductive structure. The package structure further includes a protective layer laterally surrounding the conductive structure and the semiconductor chip. The first portion of the conductive structure has a sidewall extending from the second portion to a surface of the protective layer. The protective layer laterally surrounds an entirety of the sidewall of the first portion.
Claims20
A package structure, comprising:
- a conductive structure having a first portion and a second portion, wherein the second portion is wider than the first portion;
- a semiconductor chip laterally separated from the conductive structure;
- and
- a protective layer laterally surrounding the conductive structure and the semiconductor chip, wherein the first portion of the conductive structure has a sidewall extending from the second portion to a surface of the protective layer, and the protective layer laterally surrounds an entirety of the sidewall of the first portion.
A package structure, comprising:
- a conductive structure having a first portion and a second portion, wherein the first portion has an inclined sidewall, and the second portion has a vertical sidewall;
- a semiconductor chip beside the conductive structure;
- and
- a protective layer laterally surrounding the conductive structure and the semiconductor chip, wherein the protective layer laterally surrounds an entirety of the inclined sidewall of the first portion and the vertical sidewall of the second portion.
A package structure, comprising:
- a conductive structure having a first portion and a second portion, wherein the second portion is wider than the first portion;
- a semiconductor chip beside the conductive structure;
- and
- a protective layer laterally surrounding the conductive structure and the semiconductor chip, wherein the protective layer has a first surface and a second surface opposite to the first surface, the first surface of the protective layer and an end of the first portion are level, and the second surface of the protective layer and an end of the second portion are level.
Dependencies are inferred from the claim text.