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US 2023/0154835 A1Published application
Semiconductor package including connection pad including groove pattern
AssigneeSK hynix Inc.
InventorsSi Yun KIM, Kang Hun KIM, Jun Yong SONG
Life of this patent
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Abstract
A semiconductor package includes a package substrate, a connection pad including a recessed portion disposed on one surface of the package substrate, and an insulating pattern disposed on the one surface of the package substrate to be spaced apart from the connection pad. The connection pad includes an outer sidewall, an inner sidewall in the recessed portion inclining in an inward direction from an upper portion, and a groove pattern formed on the inner sidewall.
Claims20
A semiconductor package comprising:
- a package substrate;
- a connection pad including a recessed portion disposed on one surface of the package substrate;
- and
- an insulating pattern disposed on the one surface of the package substrate to be spaced apart from the connection pad,
- wherein the connection pad comprises:
- an outer sidewall;
- an inner sidewall in the recessed portion, the inner sidewall inclining in an inward direction from an upper portion;
- and
- a groove pattern formed on the inner sidewall.
6 more elements
A semiconductor package comprising:
- a package substrate;
- a connection pad including a recessed portion disposed to protrude from one surface of the package substrate;
- and
- a solder connection structure disposed on the connection pad,
- wherein the connection pad comprises:
- an outer sidewall;
- an inner sidewall in the recessed portion, the inner sidewall inclining in an inward direction from an upper portion;
- an inner upper surface connected to the inner sidewall;
- and
- a groove pattern forming a spiral path along a circumference of the inner sidewall in a plan view.
7 more elements
Dependencies are inferred from the claim text.