Frame mask for singulating wafers by plasma etching

A method for plasma dicing a wafer utilizing a frame mask comprising:

• providing a frame mask in a plasma chamber, the frame mask includes a mask frame for supporting a plurality of mask segments configured to define dicing channels of a wafer;
• mounting a wafer frame ring assembly with a wafer for plasma dicing on a wafer ring assembly holder of a frame lift assembly disposed in a plasma chamber of a plasma dicing tool;
• placing the frame mask onto a frame lift ring on a top of the frame lift assembly, wherein the mask segments are disposed over the wafer;
• lowing the frame lift assembly so that the wafer on the wafer ring frame assembly is fixed to an electrostatic chuck in the plasma chamber;
• and
• performing plasma dicing of the wafer in the plasma chamber.

A method for plasma dicing wafers utilizing frame masks comprising:

• providing a first frame mask in a first plasma chamber and a second frame mask in a second plasma chamber, the first and second frame masks include a mask frame for supporting a plurality of mask segments configured to define dicing channels of a wafer, the first frame mask is configured to provide dicing channels in a first direction, and the second frame mask is configured to provide dicing channels in a second direction;
• mounting a wafer frame ring assembly with a wafer for plasma dicing on a wafer ring assembly holder of a frame lift assembly disposed in the first plasma chamber of a plasma dicing tool;
• placing the first frame mask onto a frame lift ring on a top of the frame lift assembly, wherein the mask segments are disposed over the wafer;
• lowing the frame lift assembly so that the wafer on the wafer ring frame assembly is fixed to an electrostatic chuck in the first plasma chamber;
• performing plasma dicing of the wafer in the first plasma chamber;
• mounting the wafer frame ring assembly with the wafer for plasma dicing on a wafer ring assembly holder of a frame lift assembly disposed in the second plasma chamber of a plasma dicing tool;
• placing the second frame mask onto a frame lift ring on a top of the frame lift assembly, wherein the mask segments are disposed over the wafer;
• lowing the frame lift assembly so that the wafer on the wafer ring frame assembly is fixed to an electrostatic chuck in the second plasma chamber;
• performing plasma dicing of the wafer in the second plasma chamber.