Semiconductor structure and method for manufacturing same

A semiconductor structure comprising:

• a substrate, and a support structure arranged on the substrate, the support structure being provided with a plurality of accommodating trenches penetrating the support structure, each of the accommodating trenches being filled with a wire, wires being electrically connected to the substrate, wherein the support structure located between two adjacent ones of the wires comprises:
• a support layer arranged on the substrate;
• a first blocking layer covered outside the support layer, the first blocking layer and the support layer forming a cavity, inner sidewalls of the first blocking layer being attached to outer sidewalls of the support layer, and the first blocking layer being provided with a first etching hole communicated with the cavity;
• and
• a second blocking layer covered outside the first blocking layer, and an inner surface of the second blocking layer being attached to an outer surface of the first blocking layer.