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US 2023/0154781 A1Published application
Wafer placement table
AssigneeNGK Insulators, Ltd.
InventorsTatsuya KUNO, Seiya INOUE
Life of this patent
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Abstract
A wafer placement table includes an alumina base that has a wafer placement surface on its upper surface, and incorporates an electrode; a brittle cooling base bonded to a lower surface of the alumina base; and a ductile connection member stored in a storage hole, opened in a lower surface of the cooling base, in a state of restricted axial rotation and in a state of engaging with an engagement section of the storage hole, the ductile connection member having a male thread section or a female thread section.
Claims12
A wafer placement table comprising:
- an alumina base that has a wafer placement surface on its upper surface, and incorporates an electrode;
- a brittle cooling base bonded to a lower surface of the alumina base;
- and
- a ductile connection member stored in a storage hole, opened in a lower surface of the cooling base, in a state of restricted axial rotation and in a state of engaging with an engagement section of the storage hole, the ductile connection member having a male thread section or a female thread section.
1 more element
Dependencies are inferred from the claim text.