US 2023/0154778 A1 · SYSTEMS AND METHODS FOR HUMIDITY CONTROL OF FOUP DURING SEMICONDUCTOR FABRICATION

Abstract

The present disclosure relates to systems and methods for reducing the humidity within a FOUP (Front Opening Unified Pod) when loaded on an EFEM (Equipment Front End Module) for transfer of a semiconductor wafer substrate during fabrication processes. A deflector of specified structure is placed inside the EFEM above the load port of the FOUP. The deflector directs airflow in the EFEM away from the load port. The deflector includes a body with a plurality of apertures in the deflector body, and with a sloped front surface. Thus, the degree of penetration of high-humidity air from the EFEM into the FOUP is reduced.

Claims20

Dependent claims

A system for transferring a semiconductor wafer substrate to a process module, comprising:

an equipment front end module (EFEM) having at least one load port in a side thereof and a fan filter unit (FFU) in a top thereof that creates downward laminar air flow within the EFEM;
at least one deflector located on an interior surface of the EFEM above the at least one load port and below the FFU for directing laminar air flow away from the at least one load port, comprises a body having a sloped or curved front surface, a rear surface abutting the interior surface of the EFEM, and a plurality of parallel passages running from an upper surface of the body to a lower surface of the body which are angled away from the upper surface;
and
a process module configured to receive the semiconductor wafer substrate from the EFEM when a Front Opening Unified Pod (FOUP) containing the semiconductor wafer substrate is loaded at the at least one load port.

1 more element

Dependencies are inferred from the claim text.

Systems and methods for humidity control of foup during semiconductor fabrication

Life of this patent

Systems and methods for humidity control of foup during semiconductor fabrication

Life of this patent

Abstract

Claims20