Methods and systems for temperature control for a substrate

An apparatus comprising:

• a direct current (DC) power source operatively coupled to heating elements embedded in at least one of a plurality of zones of a substrate support assembly included in a processing chamber;
• and
• a controller operatively coupled to the heating element and to the DC power source, wherein the controller is to:
• cause the DC power source to supply a first DC power to the heating elements;
• determine, based on a voltage measured across the heating elements and a current measured through the heating elements as the DC power is supplied to the heating elements, that a temperature of the substrate support assembly does not satisfy a temperature condition associated with a process recipe for a process at the processing chamber
• identify, based on the measured voltage and measured current across the heating elements, a zone of the plurality of zones that is at a temperature that does not correspond to a target temperature for the zone, based on the temperature condition;
• and
• modify the DC power supplied to the heating elements embedded within the identified zone to cause the temperature of the zone to be modified to the target temperature and the temperature of the substrate support assembly to satisfy the temperature condition.

An electronics device manufacturing system comprising:

• a processing chamber comprising a substrate support assembly, the substrate support assembly comprising heating elements embedded into at least one of a plurality of zones of the substrate support assembly;
• a direct current (DC) power source configured to supply DC power to each heating element;
• and
• a controller operatively coupled to each heating element, the DC power source, wherein the controller is to:
• cause the DC power source to supply a first DC power to the one or more heating elements;
• determine, based on a voltage measured across the heating elements and a current measured through the heating elements as the DC power is supplied to the heating elements, that a temperature of the substrate support assembly does not satisfy a temperature condition associated with a process recipe for a process at the processing chamber
• identify, based on the measured voltage and measured current across the heating elements, a zone of the plurality of zones that is at a temperature that does not correspond to a target temperature for the zone, based on the temperature condition;
• and
• modify the DC power supplied to the heating elements embedded within the identified zone to cause the temperature of the zone to be modified to the target temperature and the temperature of the substrate support assembly to satisfy the temperature condition.