Staggered Metal Mesh on Backside of Device Die and Method Forming Same

A package comprising:

• a first dielectric layer;
• a first metal mesh over the first dielectric layer;
• a second dielectric layer over the first metal mesh;
• a second metal mesh over the second dielectric layer, wherein the first metal mesh and the second metal mesh are staggered;
• a third dielectric layer over the second metal mesh;
• a die-attach film over and physically contacting the third dielectric layer, wherein the die-attach film overlaps the first metal mesh and the second metal mesh;
• a package component over and contacting the die-attach film;
• an encapsulant encapsulating the package component therein;
• and
• redistribution lines over and electrically connecting to the package component.

A package comprising:

• a first metal plate comprising a first plurality of openings, wherein the first plurality of openings comprise first centers;
• a second metal plate overlapping the first metal plate, the second metal plate comprising a second plurality of openings, wherein the second plurality of openings comprise second centers, and wherein the first centers of the first plurality of openings are vertically offset from the second centers of the second plurality of openings;
• a dielectric layer over the second metal plate and extending into the second plurality of openings;
• and
• a device die overlapping the first metal plate and the second metal plate.