Substrate treating method and substrate treating apparatus

A substrate treating apparatus comprising:

• a housing defining a treating space;
• a chuck supporting and heating a substrate at the treating space;
• an electrode configured to generate a plasma at a plasma space in fluid communication with the treating space;
• a power module configured to apply a power to the electrode;
• an ion blocker positioned between the plasma space and the treating space, and collecting an ion from the plasma generated at the plasma space;
• a shower head positioned between the ion blocker and the treating space, the shower head and the ion blocker defining a mixing space provided between the treating space and the plasma space;
• a gas supply unit configured to supply a gas to the plasma space or the mixing space;
• an exhaust unit configured to exhaust an atmosphere of the treating space;
• and
• a controller,
• wherein the controller controls the chuck such that the chuck heats the substrate to a process temperature, controls the gas supply unit and the exhaust unit such that a pressure of the treating space is stabilized to a preset process pressure, and controls the power module to generate the plasma at the plasma space after the pressure of the treating space is stabilized to the process pressure and after a temperature of the substrate placed on the chuck is stabilized to the process temperature.