Back to results
US 2023/0147757 A1Published application
Spherical silica powder
AssigneeDenka Company Limited
InventorsTakuto OKABE, Motoharu FUKAZAWA, Toru ARAI
Life of this patent
Estimating the term…
Abstract
A spherical silica powder which, when heated from 25° C. up to 1000° C. at a rate of 30° C./min, desorbs water molecules in an amount of 0.01 mmol/g or less at 500° C. to 1000° C., and which has a specific surface area of 1 to 30 m2/g.
Claims8
A spherical silica powder which, when heated from 25° C. up to 1000° C. at a rate of 30° C./min, desorbs water molecules in an amount of 0.01 mmol/g or less at 500° C. to 1000° C., and which has a specific surface area of 1 to 30 m2/g.
Dependencies are inferred from the claim text.