Soldering system
AssigneeERSA GmbH
InventorsAlexander Diehm, Lothar Endreß, Uwe Hofmann, Benedict Fleischmann
Life of this patent
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Abstract
Soldering system, in particular a reflow soldering system, for continuous soldering of printed circuit boards along a transport direction, that includes a process channel having a preheating zone, at least one of a soldering zone and a cooling zone, including a main body, at least one covering hood that is pivotable about a hood axis between a closed position, in which the process channel is closed, and an open position, in which the covering hood is open and the process channel is accessible.
Claims12
Soldering system for continuous soldering of printed circuit boards along a transport direction,
- comprising a process channel which comprises a preheating zone, at least one of a soldering zone and a cooling zone,
- comprising a main body and comprising at least one covering hood, the covering hood being pivotable about a hood axis provided parallel to the transport direction, between a closed position, in which the process channel is closed, and an open position, in which the covering hood is open and the process channel is accessible, and
- comprising at least one drive unit which comprises a motor and a lifting element such that the motor actuates the lifting element for opening and/or closing the covering hood,
- characterized in that the motor is arranged on the covering hood and in that the lifting element is supported on the main body when the covering hood is displaced into the open position and/or into the closed position.
Dependencies are inferred from the claim text.