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US 2023/0147501 A1Published application
Method for cleaning substrate and system for cleaning substrate
AssigneeChangxin Memory Technologies, Inc.
InventorShih-Hung LEE
Life of this patent
Estimating the term…
Abstract
A method for cleaning a substrate includes the following: exposing the substrate to a cleaning agent to remove impurities on a surface of the substrate; exposing the substrate to a dewetting chemical agent in a liquid phase to remove the cleaning agent on the surface of the substrate; solidifying the dewetting chemical agent in the liquid phase remaining on the surface of the substrate to obtain the dewetting chemical agent in a solid phase; and sublimating and removing the dewetting chemical agent in the solid phase.
Claims18
A method for cleaning a substrate, comprising:
- exposing the substrate to a cleaning agent, to remove impurities on a surface of the substrate;
- exposing the substrate to a dewetting chemical agent in a liquid phase, to remove the cleaning agent on the surface of the substrate;
- solidifying the dewetting chemical agent in the liquid phase remaining on the surface of the substrate, to obtain the dewetting chemical agent in a solid phase;
- and
- sublimating and removing the dewetting chemical agent in the solid phase.
2 more elements
A system for cleaning a substrate, comprising:
- a chamber for receiving and processing the substrate;
- a wafer stage for supporting and clamping the substrate in the chamber;
- a nozzle for at least providing a dewetting chemical agent in a liquid phase to a surface of the substrate;
- a vacuum pump for controlling a pressure of the chamber;
- a temperature controller for controlling a temperature of the substrate and/or the chamber;
- an atmosphere control system for exhausting a gas from the chamber or supplying a gas into the chamber;
- and
- a controller in communication with the vacuum pump, the temperature controller, and the atmosphere control system, and configured to solidify the dewetting chemical agent in the liquid phase to a dewetting chemical agent in a solid phase, and configured to remove the dewetting chemical agent in the solid phase.
5 more elements
Dependencies are inferred from the claim text.