Back to results
US 2023/0147342 A1Published application
Wiring circuit board
AssigneeNitto Denko Corporation
InventorsShusaku SHIBATA, Teppei NIINO, Yosuke NAKANISHI
Life of this patent
Estimating the term…
Abstract
Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and covering the conductive pattern, and a third protective layer disposed between the conductive pattern and the second insulating layer and protecting the conductive pattern. The third protective layer consists of a metal oxide.
Claims4
A wiring circuit board comprising:
- a first insulating layer;
- a conductive pattern disposed on the first insulating layer;
- a second insulating layer disposed on the first insulating layer and covering the conductive pattern;
- and
- a protective layer disposed between the conductive pattern and the second insulating layer and protecting the conductive pattern,
- wherein the protective layer consists of a metal oxide.
3 more elements
Dependencies are inferred from the claim text.