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US 2023/0147273 A1Published application
Warpage Compensation for BGA Package
AssigneeApple Inc.
InventorsBrett W. Degner, Jie-Hua Zhao, Kristopher P. Laurent, Michael E. Leclerc, Rangaraj Dhanasekaran, Simon J. Trivett
Life of this patent
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Abstract
Electronic assemblies and methods of assembly are described. In an embodiment, an electronic assembly includes a stiffener structure shear bonded to an opposite side of a module substrate from a ball grid array (BGA) package. The stiffener structure may be shear bonded at elevated temperature after bonding of the BGA package to lock in a flat or near-flat surface contour of the module substrate.
Claims21
An electronic assembly comprising:
- a module substrate including a first side and a second side opposite the first side;
- a ball grid array (BGA) package bonded to the first side of the module substrate;
- and
- a stiffener structure bonded to the second side of the module substrate, the stiffener structure spanning an area directly opposite the module substrate of the BGA package;
- wherein the stiffener structure is shear bonded to the second side of the module substrate.
2 more elements
A method of assembling an electronic assembly comprising:
- mounting a first plurality of first components onto a first side of a module substrate and a second plurality of second components onto a second side of a module substrate;
- mounting a ball grid array (BGA) package onto the first side of the module substrate with a plurality of solder bumps characterized by a melting temperature greater than 200° C.;
- and
- after mounting the BGA package, mounting a stiffener structure onto second side of the module substrate with at a moderate bonding temperature of less than 200° C. to create a shear bonded interface with the second side of the module substrate.
1 more element
Dependencies are inferred from the claim text.