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US 2023/0146838 A1Published application
Control module, method for manufacturing same, and electronic device
AssigneeBoe Technology Group Co., Ltd.
InventorsMeizhu Zheng, Yuanyuan Li, Dalin Xiang, Jiuzhen Wang
Life of this patent
Estimating the term…
Abstract
Provided is a control module including a printed circuit board, an IC, and a shielding cover. The shielding cover is provided with a dispensing hole for adhesive dispensing. The IC is soldered onto the printed circuit board, and an adhesive may be dispensed between the IC and the printed circuit board through the dispensing hole. A method for manufacturing a control module is also provided.
Claims20
A control module, comprising:
- a printed circuit board;
- an integrated circuit (IC) disposed on the printed circuit board;
- and
- a shielding cover soldered onto the printed circuit board and housing the IC inside;
- wherein the shielding cover is provided with a dispensing hole for adhesive dispensing.
2 more elements
A method for manufacturing a control module, comprising:
- providing a printed circuit board;
- arranging an integrated circuit (IC) on the printed circuit board;
- soldering a shielding cover onto the printed circuit board, the shielding cover housing the IC inside and being provided with a dispensing hole for adhesive dispensing;
- and
- dispensing an adhesive between the IC and the printed circuit board through the dispensing hole.
2 more elements
Dependencies are inferred from the claim text.