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US 2023/0146732 A1Published application
Apparatus for plating and method of plating
AssigneeEbara Corporation
InventorsKazuma IDEGUCHI, Hideki WAKABAYASHI, Ryuya KOIZUMI
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AssigneeEbara Corporation
InventorsKazuma IDEGUCHI, Hideki WAKABAYASHI, Ryuya KOIZUMI
Estimating the term…
One object of the present disclosure is to improve the accuracy of detection of an abnormality of various devices, and/or to advance the timing of detection of an abnormality. There is provided an apparatus for plating a substrate, comprising: an anode placed to be opposed to the substrate; an electric field regulating member placed between the substrate and the anode, provided with an opening, and equipped with an opening adjustment member configured to change a dimension of the opening; a motor configured to drive the opening adjustment member; and a control device configured to obtain an electric current value or a load factor of the motor, to calculate an amount of change in the load factor of the motor per unit time from the obtained electric current value or the obtained load factor of the motor, and to detect an abnormality of the electric field regulating member when it is detected that the amount of change in the load factor of the motor per unit time exceeds a predetermined threshold value.
An apparatus for plating a substrate, comprising:
A method of plating a substrate, comprising:
A storage medium configured to store a program that causes a computer to perform a method of detecting an abnormality of an electric field regulating member of a plating apparatus, wherein the program causes the computer to perform:
Dependencies are inferred from the claim text.