Method of manufacturing semiconductor device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJING-CHENG LIN, LI-HUI CHENG, PO-HAO TSAI
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Abstract
A method of manufacturing a semiconductor device includes following operations. A substrate is received. An electrical conductor is formed over a surface of the substrate. A photo-curable material is selectively dispensed over the surface of the substrate. The photo-curable material is irradiated to form a passivation layer is formed over the surface of the substrate. The passivation layer partially covers an edge of the electrical conductor.
Claims20
A method of manufacturing a semiconductor device, comprising:
- receiving a substrate;
- forming an electrical conductor over a surface of the substrate;
- selectively dispensing a photo-curable material over the surface of the substrate;
- and
- irradiating the photo-curable material to form a passivation layer over the surface of the substrate, wherein the passivation layer partially covers an edge of the electrical conductor.
A method of manufacturing a semiconductor device, comprising:
- receiving a substrate having at least a through hole penetrating the substrate;
- forming an electrical conductor in the through hole and over a surface of the substrate;
- forming a conductive bump over the electrical conductor;
- selectively dispensing a photo-curable material over the surface of the substrate;
- and
- irradiating the photo-curable material to form a passivation layer over the surface of the substrate, wherein the passivation layer partially covers an edge of the electrical conductor.
A method of manufacturing a semiconductor device, comprising:
- receiving a substrate having a first surface and a second surface opposite to the first surface;
- forming at least a through hole penetrating the substrate;
- forming a first electrical conductor in the through hole and over the first surface of the substrate;
- selectively dispensing a photo-curable material over the first surface of the substrate;
- irradiating the photo-curable material to form a passivation layer over the first surface of the substrate, wherein the passivation layer partially covers an edge of the first electrical conductor;
- and
- forming a circuit layer over the second surface of the substrate, and electrically connected to the first electrical conductor.
Dependencies are inferred from the claim text.