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US 2023/0146579 A1Published application
Engineered materials for electronics assembly
OwnerRanjit PANDHER, Niveditha NAGARAJAN +2inventors
InventorsRanjit PANDHER, Niveditha NAGARAJAN, Girard SIDONE, Carl BILGRIEN
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Abstract
A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.
Claims21
1-28. (canceled)
A solder material for use in electronic assembly, the solder material comprising:
- solder layers;
- and
- a core layer comprising a core material, the core layer being sandwiched between the solder layers,
- wherein:
- the thermal conductivity of the core material is greater than the thermal conductivity of the solder.
2 more elements
Dependencies are inferred from the claim text.