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US 2023/0146353 A1Published application
3d semiconductor device and structure with logic and memory
AssigneeMonolithic 3D Inc.
InventorsZvi Or-Bach, Jin-Woo Han
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Abstract
A 3D device, the device including: a first level including logic circuits; a second level including a plurality of memory circuits, where the first level is bonded to the second level, where the bonded includes oxide to oxide bonds, and where the first level includes at least one voltage regulator circuit.
Claims20
A 3D device, the device comprising:
- a first level comprising logic circuits;
- and
- a second level comprising a plurality of memory circuits,
- wherein said first level is bonded to said second level,
- wherein said bonded comprises oxide to oxide bonds, and
- wherein said first level comprises at least one voltage regulator circuit.
3 more elements
A 3D device, the device comprising:
- a first level comprising logic circuits;
- and
- a second level comprising a plurality of memory cells,
- wherein said first level is bonded to said second level,
- wherein said bonded comprises oxide to oxide bonds, and
- wherein said logic circuits comprise at least one power down control circuit.
3 more elements
A 3D device, the device comprising:
- a first level comprising logic circuits;
- and
- a second level comprising a plurality of memory circuits,
- wherein said first level is bonded to said second level,
- wherein said bonded comprises oxide to oxide bonds, and
- wherein said logic circuits comprise a plurality of antifuse structures.
3 more elements
Dependencies are inferred from the claim text.