Apparatus and methods for semiconductor processing
AssigneeApplied Materials, Inc.
InventorsJoseph Yudovsky, Kaushal Gangakhedkar
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Abstract
Described are apparatus and methods for processing a semiconductor wafer so that the wafer remains in place during processing. The wafer is subjected to a pressure differential between the top surface and bottom surface so that sufficient force prevents the wafer from moving during processing, the pressure differential generated by applying a decreased pressure to the back side of the wafer.
Claims20
A semiconductor processing susceptor assembly, the susceptor assembly comprising:
- a top surface, a bottom surface, and a plurality of recesses in the top surface to support a plurality of wafers, the plurality of recesses positioned so that a central axis of the wafer is offset from a central axis of the susceptor assembly, each of the plurality of recesses having a bottom surface;
- and
- at least one passage extending between the bottom surface of each of the plurality of recesses and the bottom surface of the susceptor assembly.
The susceptor assembly of claim 11, wherein when a wafer is positioned within each of the plurality of recesses, there is a pressure differential between the top surface of a wafer and the bottom surface of the wafer greater than about 10 torr.
Dependencies are inferred from the claim text.