Fabrication Method of MEMS Transducer Element
AssigneeTE Connectivity Solutions GmbH
InventorsJean-Francois Le Neal, Kaspar Jenni
Life of this patent
Estimating the term…
Loading patent…
AssigneeTE Connectivity Solutions GmbH
InventorsJean-Francois Le Neal, Kaspar Jenni
Estimating the term…
A method of fabricating a plurality of individual microelectromechanical transducer elements includes forming a plurality of microelectromechanical transducer elements on a wafer. Each microelectromechanical transducer element has a sensitive region with a membrane and a sensing element monitoring at least one measurand and generating an electrical signal correlated with the at least one measurand, and an electrical contact outputting the electrical signal. The method includes providing, for each microelectromechanical transducer element, a sealing structure around a sensitive region and an electrical connection connected to the electrical contact. The sealing structure and the electrical connection are made out of a reflow solder material. The method includes dicing the wafer to form individual microelectromechanical transducer elements.
A method of fabricating a plurality of individual microelectromechanical transducer elements, comprising the steps of:
A microelectromechanical transducer element, comprising:
A microelectromechanical sensor arrangement, comprising:
Dependencies are inferred from the claim text.