High modulus colorless polyimide film and method of preparation
AssigneeRAYITEK Hi-Tech Film Company, Ltd., Shenzhen
InventorsYanYan JIANG, Xi REN, ZhenZhong WANG, LiGuo XIAO
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AssigneeRAYITEK Hi-Tech Film Company, Ltd., Shenzhen
InventorsYanYan JIANG, Xi REN, ZhenZhong WANG, LiGuo XIAO
Estimating the term…
A polyimide precursor solution is disclosed, and a colorless transparent polyimide film manufactured from the polyimide precursor solution. The polyimide precursor solution has diamines, a first dianhydride represented by biphenyl dianhydride, a second dianhydride represented by rigid alicyclic dianhydride, a third dianhydride represented by non-alicyclic dianhydrides and organic solvent. The colorless polyimide films have a modulus of 4.5 GPa or higher, a glass-transition temperature (Tg) of 370° C. or higher, and a yellow index of 3.0 or lower. These polyimide films can be used as substrates for thin film transistor (TFT), touch sensor panel (TSP), and cover window applications in flexible display such as organic light-emitting diode (OLED), flexible liquid crystal display (LCD) and other fields.
A method for manufacturing a transparent polyimide film, the method comprising the steps of:
A method for manufacturing a transparent polyimide film, the method comprising the steps of:
Dependencies are inferred from the claim text.