Die bonding structure, stack structure, and method of forming die bonding structure
AssigneeNanya Technology Corporation
InventorHsih-Yang CHIU
Life of this patent
Estimating the term…
Abstract
A die bonding structure includes a first die and a second die. The first die includes a first sealing ring and a plurality of first metal contacts, wherein sidewalls of the first metal contacts align a sidewall of the first sealing ring. The second die includes a second sealing ring and a plurality of second metal contacts, wherein sidewalls of the second metal contacts align a sidewall of the second sealing ring. The first metal contacts are directly bonded to the second metal contacts, respectively, and the first sealing ring is directly bonded to the second sealing ring.
Claims20
A die bonding structure, comprising:
- a first die comprising a first sealing ring and a plurality of first metal contacts, wherein sidewalls of a first group of the first metal contacts align a first sidewall of the first sealing ring;
- and
- a second die comprising a second sealing ring and a plurality of second metal contacts, wherein sidewalls of the second metal contacts align a sidewall of the second sealing ring, the first group of the first metal contacts are directly bonded to the second metal contacts, respectively, and the first sealing ring is directly bonded to the second sealing ring.
A stack structure, comprising:
- a printed circuit board;
- a first die disposed on the printed circuit board and comprising a first sealing ring and a plurality of first metal contacts;
- and
- a second die disposed on the printed circuit board and comprising a second sealing ring and a plurality of second metal contacts,
- wherein the first sealing ring is directly bonded to the second sealing ring, and the first metal contacts are directly bonded to the second metal contacts, respectively, and
- wherein a bonding direction of the first die and the second die is perpendicular to a normal direction of the printed circuit board.
A method of forming a die bonding structure, comprising:
- cutting a first wafer to provide a first die, wherein a first sealing ring and a plurality of first metal contacts are exposed from a sidewall of the first die after cutting the first wafer;
- cutting a second wafer to provide a second die, wherein a second sealing ring and a plurality of second metal contacts are exposed from a sidewall of the second die after cutting the second wafer;
- and
- bonding the first sealing ring to the second sealing ring and bonding the first metal contacts to the second metal contacts.
Dependencies are inferred from the claim text.