Chuck assembly, fabrication system therewith, and method of fabricating semiconductor device using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSeongha JEONG, Kyung-Sun KIM, Dongwan KIM, Donghyeon NA, Dougyong SUNG, Myeongsoo SHIN, Ungyo JUNG
Life of this patent
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Abstract
A chuck assembly includes a chuck base including a lower base and an upper base that is on the lower base, a ceramic plate on the upper base, an isolator ring enclosing an outer sidewall of the lower base, a focus ring on an edge portion of the lower base and the isolator ring, the focus ring enclosing an outer sidewall of the upper base, and a pad that is between the edge portion of the lower base and the focus ring. The pad may contain a nonmetal conductive material.
Claims20
A chuck assembly, comprising:
- a chuck base including a lower base and an upper base that is on the lower base;
- a ceramic plate on the upper base;
- an isolator ring enclosing an outer sidewall of the lower base;
- a focus ring on an edge portion of the lower base and the isolator ring, the focus ring enclosing an outer sidewall of the upper base;
- and
- a pad that is between the edge portion of the lower base and the focus ring,
- wherein the pad contains a nonmetal conductive material.
A semiconductor device fabrication system, comprising:
- a chamber;
- a shower head in an upper portion of the chamber;
- and
- a chuck assembly in a lower portion of the chamber, the chuck assembly configured to contain a substrate,
- wherein the chuck assembly includes
- a chuck base including a lower base and an upper base that is on the lower base,
- a ceramic plate on the upper base,
- an isolator ring enclosing an outer sidewall of the lower base,
- a focus ring on an edge portion of the lower base and the isolator ring such that the focus ring encloses an outer sidewall of the upper base, and
- a pad that is between the edge portion of the lower base and the focus ring,
- wherein the pad contains a nonmetal conductive material.
A method of fabricating a semiconductor device, the method comprising:
- placing a substrate on a chuck assembly;
- providing a reaction gas on the substrate;
- and
- supplying a radio frequency power to produce a plasma on the substrate,
- wherein the chuck assembly includes
- a chuck base including a lower base and an upper base that is on the lower base;
- a ceramic plate on the upper base;
- an isolator ring enclosing an outer sidewall of the lower base;
- a focus ring on an edge portion of the lower base and the isolator ring, the focus ring enclosing an outer sidewall of the upper base;
- and
- a pad that is between the edge portion of the lower base and the focus ring,
- wherein the pad contains a nonmetal conductive material.
Dependencies are inferred from the claim text.