Semiconductor device

A semiconductor device comprising:

• a first semiconductor element comprising a first face and a second face opposite to the first face, wherein a first electrode is provided in the first face and a second electrode is provided in the second face;
• a second semiconductor element comprising a third face and a fourth face opposite to the third face, wherein a third electrode is provided in the third face and a fourth electrode is provided in the fourth face;
• a first insulating base member comprising a fifth face to which the first face of the first semiconductor element is adhesively bonded, and a sixth face opposite to the fifth face;
• a second insulating base member comprising a seventh face to which the third face of the second semiconductor element is adhesively bonded, and an eighth face opposite to the seventh face;
• a first wiring that penetrates through the first insulating base member to be electrically connected to the first electrode, and that is disposed on the sixth face of the first insulating base member;
• a second wiring that penetrates through the second insulating base member to be electrically connected to the third electrode, and that is disposed on the eighth face of the second insulating base member;
• a first wiring member that faces the second face of the first semiconductor element, and that is electrically connected to the second electrode;
• and
• a second wiring member that is provided on the second wiring to be electrically connected to the second wiring,
• wherein:
• the first wiring member is provided on the seventh face of the second insulating base member;
• the first wiring member and the second wiring member face each other and are electrically connected to each other;
• and
• a current flows in a first direction in the first wiring member, and flows in a second direction opposite to the first direction in the second wiring member.