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US 2023/0145264 A1Published application
Photosensitive resin composition, photosensitive element, and method for producing wiring board
AssigneeShowa Denko Materials Co., Ltd.
InventorsKeishi ONO, Seiji SUNOHARA, Tetsuro YAMASHITA, Yuya HIRAYAMA
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Abstract
A photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and an anthracene-based sensitizer, in which the binder polymer contains a polymer (a) having a hydroxyalkyl (meth)acrylate unit and a styrene or styrene derivative unit and having a content of the styrene or styrene derivative unit of 40% by mass or more.
Claims10
A photosensitive resin composition comprising:
- a binder polymer;
- a photopolymerizable compound;
- a photopolymerization initiator;
- and an anthracene-based sensitizer, wherein
- the binder polymer comprises a polymer (a) having a hydroxyalkyl (meth)acrylate unit and a styrene or styrene derivative unit and having a content of the styrene or styrene derivative unit of 40% by mass or more.
2 more elements
Dependencies are inferred from the claim text.