Cleaning liquid for semiconductor substrate
AssigneeFUJIFILM Corporation
InventorTetsuya KAMIMURA
Life of this patent
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Abstract
There is provided a cleaning liquid for a semiconductor substrate, which has excellent cleaning performance with respect to a semiconductor substrate including a metal film after CMP and has a small surface roughness of a metal film after cleaning. The cleaning liquid for a semiconductor substrate according to the present invention is a cleaning liquid for a semiconductor substrate, which is used for cleaning a semiconductor substrate, including a compound represented by Formula (1), a compound represented by Formula (2), a primary amino alcohol having a primary amino group or a secondary amino group, a tertiary amine; and a solvent.
Claims20
A cleaning liquid for a semiconductor substrate, which is used for cleaning a semiconductor substrate, the cleaning liquid comprising:
- a compound represented by Formula (1);
- a compound represented by Formula (2);
- a primary amino alcohol having a primary amino group or a secondary amino group;
- a tertiary amine;
- and
- a solvent,
- in Formula (1), R1 to R4 each independently represent a hydrocarbon group which may have a substituent, and
- X− represents an anion,
- provided that a case where all of R1 to R4 represent a methyl group is excluded,
- in Formula (2), L represents a single bond or a divalent linking group.
Dependencies are inferred from the claim text.