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US 2023/0145005 A1Published application
Inverter device
AssigneeDaikin Industries, Ltd.
InventorsMasahide FUJIWARA, Nobuyasu HIRAOKA, Keito KOTERA, Taku ITOU, Masaki KOUNO, Reiji KAWASHIMA
Life of this patent
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Abstract
To achieve high density integration of components while securing an insulation distance between a bootstrap capacitor and an intelligent power module. In a printed wiring board, a region where a capacitor is mounted is located in a region where an intelligent power module is mounted. Therefore, the capacitor mounted on the printed wiring board is placed between the printed wiring board and the intelligent power module.
Claims16
An inverter device comprising:
- a printed wiring board;
- an intelligent power module mounted on a first surface of the printed wiring board,
- the intelligent power module including
- a package, and
- an upper arm-side switching element and a lower arm-side switching element incorporated in the package and constituting at least an inverter circuit;
- and
- a bootstrap capacitor mounted on the first surface of the printed wiring board,
- the bootstrap capacitor being configured to be charged during an ON operation of the lower arm-side switching element and generate a potential higher than a low potential at the upper arm-side switching element,
- the bootstrap capacitor being placed between the printed wiring board and the intelligent power module.
6 more elements
Dependencies are inferred from the claim text.