Stacked image sensor
AssigneeOmniVision Technologies, Inc.
InventorsZhiyong ZHAN, Yin QIAN
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Abstract
A stacked image sensor includes a signal-processing circuitry layer, a pixel-array substrate, a heat-transport layer, and a thermal via. The signal-processing circuitry layer includes a conductive pad exposed on a circuitry-layer bottom surface of the signal-processing circuitry layer. The pixel-array substrate includes a pixel array and is disposed on a circuitry-layer top surface of the signal-processing circuitry layer. The circuitry-layer top surface is between the circuitry-layer bottom surface and the pixel-array substrate. The heat-transport layer is located between the signal-processing circuitry layer and the pixel-array substrate. The thermal via thermally couples the heat-transport layer to the conductive pad.
Claims22
A stacked image sensor comprising:
- a signal-processing circuitry layer including a conductive pad exposed on a circuitry-layer bottom surface of the signal-processing circuitry layer;
- a pixel-array substrate including a pixel array and being disposed on a circuitry-layer top surface of the signal-processing circuitry layer, the circuitry-layer top surface being between the circuitry-layer bottom surface and the pixel-array substrate;
- a heat-transport layer located between the signal-processing circuitry layer and the pixel-array substrate;
- and
- a thermal via that thermally couples the heat-transport layer to the conductive pad.
A stacked image sensor comprising:
- a heat-sink layer;
- a signal-processing circuitry layer disposed on the heat-sink layer;
- a pixel-array substrate including a pixel array and being disposed on the signal-processing circuitry layer;
- a heat-transport layer located between the signal-processing circuitry layer and the pixel-array substrate;
- and
- a thermal via that thermally couples the heat-transport layer to the heat-sink layer.
Dependencies are inferred from the claim text.