Substrate treating apparatus and semiconductor manufacturing equipment including the same

A facility for manufacturing a semiconductor comprising:

• an index module including a first transfer robot and for carrying out and transferring a substrate mounted on a container using the first transfer robot;
• a transfer module including a second transfer robot and for relaying the substrate transferred by the index module using the second transfer robot;
• a buffer chamber for heating the substrate relayed by the transfer module;
• and
• a process chamber for treating the substrate heated by the buffer chamber,
• wherein the buffer chamber heats the substrate while the substrate waits before being loaded into the process chamber, and heats the substrate while the substrate treated by the process chamber waits before being carried out,
• wherein, in response to the process chamber being plural, the buffer chamber is provided separately in each process chamber, and is coupled to a front surface of the process chamber, into which the substrate is loaded,
• wherein the buffer chamber provides a purge gas to the substrate while the substrate is heated, and the purge gas is a gas having a high temperature higher than room temperature.

An apparatus for treating a substrate comprising:

• a process chamber for treating a substrate;
• and
• a buffer chamber for providing a space, in which the substrate waits,
• wherein the substrate waits in the buffer chamber before being loaded into the process chamber, and waits in the buffer chamber before being carried out after being treated by the process chamber,
• wherein the buffer chamber heats the substrate while the substrate waits.