Apparatus for processing substrate

An apparatus for processing a substrate comprising:

• a chamber including a processing space therein;
• a substrate support unit disposed in the processing space and for supporting a substrate;
• a first vacuum pump;
• a second vacuum pump connected to the first vacuum pump;
• a first valve connected between the second vacuum pump and the processing space of the chamber;
• and
• a second valve disposed between the second vacuum pump and the substrate support unit,
• wherein the second vacuum pump reduces a pressure in a space between the substrate support unit and the substrate to fix the substrate to the substrate support unit in response to the second valve being turned on.

An apparatus for processing a substrate comprising:

• a chamber including a processing space therein;
• a substrate support unit disposed in the processing space and including an upper exposed hole and a flow path connected to the hole;
• a first vacuum pump connected to the processing space through a first valve;
• a second vacuum pump connected to the first vacuum pump through a second valve and connected to the processing space through a third valve;
• and
• a fourth valve connecting the flow path of the substrate support unit and the first vacuum pump,
• wherein the first vacuum pump reduces a pressure in the processing space in response to the first valve being turned on,
• wherein the second vacuum pump reduces a pressure in the processing space in response to the second valve and the third valve being turned on,
• wherein the first vacuum pump reduces a pressure of the flow path to fix the substrate to the substrate support unit in response to the substrate being mounted on the substrate support unit and the fourth valve being turned on,
• wherein the fourth valve is turned off after processing of the substrate is completed,
• wherein the substrate is carried out after the fourth valve is turned off.